Sputter systems for LCD/SMD X systems

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SMD-X Systems

With the increase in size of LC panels and manufacturing mother glass, manufacturing equipment has also become larger, requiring ever-larger equipment investments. For the past several years, ULVAC has been responding to increasing mother glass sizes by developing new-concept systems to replace the cluster-type systems currently prevalent. ULVAC's systems support larger substrate sizes while remaining compact and low-priced. The new concepts they employ enable staggered, highly effective investment with low initial outlay.

 

 

Features

  • Designed primarily to improve investment effectiveness
  • Support large substrates (1200 x 1300 mm in max.)
  • Mechanical tact time of 120 to 130 seconds/substrate
  • Applications support various deposition needs

System Configuration (Standard)

  • Number of loading/unloading chambers : 2 (with substrate heating mechanism)
  • Number of transfer chambers : 1
  • Number of sputter chambers : 2 (1 to 3 cathodes can be mounted, depending on model)

Options

  • Substrate transfer devices: 1
  • X-models: SMD-750BX, SMD-750BX2, SMD-850BX, SMD-850BX3, SMD-950X, SMD-950X3, SMD-1200BX,  SMD-1200CX
  • Maximum substrate sizes supported (mm) : 630 x 750, 630 x 750, 680 x 890, 680 x 890, 730 x 920, 750 x 950, 1100 x 1250, 1200 x 1300
  • Cycle (mechanical tact) time (seconds/substrate) : 120sec./pc, 120sec./pc, 125sec./pc, 125sec./pc, 130sec./pc, 130sec./pc