Nano Particles Technology
Sputtering Target Selection Guide
Sputtering Targets and Evaporation Materials
Sputtering Targets for Cu Wiring
Nano Particles Technology
Dispersed Nano particle paste is new type of paste, which consists of 0.01um diameter nano particles. These pastes can be used to easily form a film of Au, Ag, Cu, etc. by brush-spreading, dipping, spin-coating, etc.
Products Available
|
Perfect Gold
|
Au Solution
|
|
Perfect Silver
|
Ag Solution
|
Nanometal Ink Technology
Ulvac offers Gold, Silver and ITO nanometal inks for inkjet printing applications. Particle sizes are typically between 3 to 7 nm, and various types of metal % content, solvents and viscosities are available, as described in the matrix chart below.
Nanometal Ink Product
|
Product Name
|
Au-Nanometal Ink
|
Ag-Nanometal
|
Ag-Nanometal Ink
(Low Temperature Type) |
ITO-Nanometal Ink
|
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|
Type |
Au1T
|
Au1TeH
|
Au2T
|
Au2az
|
Ag1T
|
Ag1TeH
|
Ag2T
|
L-Ag1T
|
L-Ag1TeH
|
ITO01Dn
|
|
For Ink Jet
|
N/A
|
Good
|
N/A
|
N/A
|
N/A
|
Good
|
N/A
|
N/A
|
Good
|
Good
|
|
Metal |
30
|
60~70
|
40
|
55~60
|
30
|
55~60
|
30
|
30
|
55~60
|
20
|
|
Solvent
|
Toluene
|
n-tetradecane
|
Toluene
|
Tetra-decane
|
Toluene
|
Tetra-decane
|
Toluene
|
Toluene
|
Tetra-decane
|
Decalin
|
|
Adhesiveness
Improving Additives |
--
|
--
|
Cu, Bi
|
Cu, Bi
|
--
|
--
|
Cu, Bi
|
--
|
--
|
--
|
|
Ave.particle
size (nm) |
3~7
|
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|
Viscosity
(mPa's) |
<5
|
5~15
|
<5
|
4000~
10000 |
<5
|
5~15
|
<5
|
<5
|
5~15
|
<5
|
Properties of curing layer (Data provided hereunder is for reference only and not guarantee)
|
Product Name
|
Au1T / Au1TeH
|
Au2T / Au2az
|
Au1T / Au1TeH / Au2T
|
L-Ag1T / L-Ag1TeH
|
IT O 1Dn
|
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|
Curing Condition
|
350°Cx30min or
300°Cx30min |
300°Cx30min
|
220°Cx30min
|
150°Cx60min
|
*1
|
|||||
|
Layer After |
<1
|
<1
|
<1
|
<2
|
<1
|
<1
|
<1
|
<1
|
<1
|
<0.5
|
|
Resistivity
(µΩcm) |
8~10 (350°Cx30min)
12~15 (300°Cx30min) |
~ 20
|
~ 3
|
~ 3
|
~ 10
|
~ 10
|
3x104
|
|||
|
Substrates to be used |
Substrates having allowable temperature limit exceeding curing temperature should be used
(e.g. glass, polyimide, Ni, Cu, ceramics etc) |
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|
Adhesion Strength (kg/mm2)
|
<1
|
<1
|
>2
|
<1
|
<1
|
>2
|
<1
|
<1
|
>2
|
|
*1) 230°Cx10min in 8Pa Vac + 230°Cx60min in Air
*2) Please consult us on the type not listed herein.
Specification in this sheet is subject to change without notice.