Jsputter JSP-8000
MPS Series Ultra-High Vacuum Helicon Sputter Systems
MPS-4000-HC6 Sputtering System for MRAM/TMR Research
R und D Dielectric Sputtering System
Compound Organic/Inorganic Deposition Systems
Sputtering Systems
Jsputter JSP-8000 Sputtering System for R&D
Jsputter is available for small production or research and development of multi-layer thin film, compound materials or other devices, using automatic process operation by PC. From 2inch to 8 inch size substrate is available.
Features
- Side deposition configuration is adopted for reduction of particles.
- 4 inch dia. cathodes of 4 sets are equipped for standard spec. Substrate is available for 2-8 inch dia.
- System is operated automatically by PC, to put the process recipe. Wafer transfer is also automatically driven.
- Col sputtering configuration for muiti layer film. Additional power supply is available for simultaneous sputtering.
- Foot space is deducted by design of all in one system.
Applications
- MRAM, magnetic sensor devices
- Pilot production of discrete devices for electrode
- Research and development for new materials
- Ferro magnetic film for MEMS or ITO film for solar cell or small FPD
Specifications
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Ultimate pressure/deposition |
Less than 7x10-5Pa
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Ultimate pressure/loadlock |
Less than 10Pa
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pumping speed at LL
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Less than 2 minuts till 10Pa
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| Uniformity |
Within f200mm ±5%
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System constitution |
Load lock & deposition chamber |
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Substrate size
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2~8 inch dia. with wafer tray
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Deposition methode
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Side deposition methode
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Cathode
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4 inch dia. x 4 sets
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Reverse sputtering
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Equipped on deposition stage
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Transfer system
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Air actuator tranfer
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Cathode power supply
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RF 500W x 1 set with selector
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Pumping system
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TMP + Rotary pump
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Control system
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PC operation
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Substrate heater/cooling
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300 degree C/ water coolin
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