Ashing System Luminous NA-1000/1300
Ashing System
Luminous NA-1000/1300
Luminous NA1000/1300 series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
Features
- High dose ion implant stripping process and polymer removal process of 10E + 16 or higher level that are necessary for critical process for next generation wafers can be implemented free of damages.
- Chamber construction is arranged most suitably for an F-based gas addition process, and particle-free treatment is possible. Therefore, it is suitable to construct an extremely wide range of processes from normal
- PR to high dose ion implant stripping process, organic films (such as PI and DFR) peeling and oxidized film etching.
- A simple system construction is adopted, achieving "excellent maintainability and reliability" and "low cost" at the same time.
- Flexible system construction is possible (µ wave, RIE, and µ wave + RIE ), allowing a wide range of transfer channel selection.
- Wafer size can be switched by simply changing the recipe setting, achieving very easy wafer size change.
Applications
- High dose ion implant stripping process (10E + 16 or higher) and polymer removal in front end process
- Wafer process that requires CF-4 addition process (electronic parts and LEDs)
- Chip size package and bump process
- CCD color filter manufacturing process
Specifications
| Model | Wafer Size |
| Luminous NA-1000 | 100mm, 125mm, 150mm and 200mm |
| Luminous NA-1300 | 200mm and 300mm |