Entron for Copper Interconnects
Entron System for Copper Metallization
Pushing the envelop of PVD, ULVAC Self-Ionized Sputter (SIS) Technology and Entron System takes you to the 45nm generation.
Features
- Space Saving Single (3 chambers) or Tandem (6 chambers) Platform
- Single Wafer Load/Unload Chambers with Degas and Cool Capabilities
- PVD and ALD compatible configuration available
