ENVIRO Optima
Copper Interconnect Metallization
ENVIRO III Platform (300mm wafer)
ENVIRO II Platform (200mm wafer)
Enviro Optima™ - The Resist Strip System with the Highest Throughput in the Smallest Footprint and Lowest Cost
The Enviro Optima™ Resist Strip System is the smallest 300mm resist strip system providing the highest throughput per square meter of cleanroom space at the lowest cost. Enviro Optima features a new remote plasma source achieving extremely quick resist removal rates of >10µm/min. Comparable in size to a typical 200mm system, Enviro Optima is the smallest 300mm resist strip system offering 3 loadports on the market. Combined with fast new wafer handling robotics, Enviro Optima's straightforward design results in the highest throughput with the smallest footprint (67wph/m2) for systems under $1 million.
With less cleanroom space required and lower price than competitor's models, this resist strip system delivers the lowest CoO, which is achieved by providing high throughput at lower total system cost. The Enviro Optima is ideal for all resist strip work including high dose implant, residue removal, and surface preparation applications.
Features
- Quick resist removal rates of >10µm/min
- Comparable in size to a typical 200mm system
- Smallest 300mm resist strip system offering 3 loadports on the market
- Throughput with the smallest footprint (67wph/m2) for systems under $1 million.