The SRH Series are single-wafer sputtering systems for mounting/UBM. An unique transfer mechanism and process chamber structure enables the extremely high cost performance demanded by deposition systems for mounting/UBM. SRH-730 (SRH-820) lets you mount up to 6 (7) process chambers, for a process chamber layout to meet precise needs.
|
SRH-730
|
SRH-820
|
SRH-420MC
|
|
| Supported substrate size |
f300/200mm
|
f200/150/100mm
|
f200/150/100mm
|
| Number of process module |
Up to 6
|
Up to 7
|
Up to 5
|
| Supported processes |
Wafer heating
|
Wafer heating
|
Wafer heating
|
|
Etching
|
Etching
|
Etching
|
|
|
Deposition
|
Deposition
|
Deposition
|
|
| Cassette used |
FOUP or OPEN
|
OPEN
|
OPEN
|
| Process chamber evacuation system |
DRY.P+TURBO.P
|
DRY.P+TURBO.P
|
DRY.P+TURBO.P
|
| Transfer chamber |
CRYO.P
|
CRYO.P
|
CRYO.P
|
| Sputter targets |
f420 x 12t
|
f300 x 12t
|
f300 x 12t
|
| Installation surface area |
W4500 x D6500mm
|
W4200 x D4000
|
W380 x D3043
|
| Control system |
Fully automatic
PC + sequencer Logging function included |
Fully automatic
PC + sequencer Logging function included |
Fully automatic
sequencer Logging function included |