Advanced Plasma Resist Strip System ENVIRO-1Xa

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The Enviro-1Xa advanced plasma resist strip system from ULVAC is the latest photoresist removal equipment offering exceptional performance at an incredible price. Specifically designed for non-300mm fabs, it is equipped with a versatile platform that can handle the complete line of wafer size ranging from 4 inch to 8 inch. The system is capable of high speed photoresist removal at more than 10μm/min, with excellent repeatability and high reliability. The Enviro-1Xa has integrated all the demands from device manufacturers – compact design, high throughput, low cost, less consumable – to deliver the lowest Cost of Ownership (CoO).

Features

  • High efficiency downstream plasma source
  • >10 μ/min ash rate
  • 70WPH (20sec process time)
  • 4” - 8” wafer size
  • Dual cassette loading
  • SMIF option
  • HEPA option
  • Temperature Control: 5°C to 80°C (cold chuck), and RT to 280°C
  • Lift pins: Process with pins up, or pins in the down position
  • Mass Flow Controllers: 2 to 6 available (including corrosive gases)
  • Gas Chemistries: O2, H2/N2, Ar, CHF3, CF4, NF3, NH3
  • Wafer Sizes: 100, 150, 200 mm

Special Features / Further Applications

  • Pins-up Ashing
  • Enviro is fully capable of ashing with Pins-up or Pins-down
  • Enables backside ashing of resist and bevel cleaning
  • Wafer can be “pre-heated” on the chuck and then lifted to enhance backside etch rate

 

150mm to 200mm Wafer Conversion

  • Enviro is fully capable of running wafers from 100mm up to 200mm diameter
  • To change from 150mm to 200mm and back is easy. Handler must be taught for each wafer size, only required 1 time on initial setup. Total time to switch is < 1 hour

Further Applications

Resist strip, Descum, MEMS Release, Bevel Clean

Any questions?
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