November 2019

ULVAC Inc. and Silex Microsystems AB Sign Joint Development Agreement on Leading-Edge Sputtered PZT for MEMS

Kanagawa, Japan – November 25th, 2019 – ULVAC, Inc. (ULVAC), headquartered in Kanagawa, Japan and lead by CEO Setsuo Iwashita and SILEX Microsystems AB (Silex), headquartered in Järfälla, Sweden and lead by CEO Edvard Kälvesten, today announced they have signed an agreement to develop a production thin film piezoelectric process (PZT) for MEMS actuators and sensors with cutting edge performance and reliability.

Silex Microsystems, a World leading MEMS foundry, has more than a decade of experience working with PZT and has now selected ULVAC’s SME200 sputtering system for the mass production of MEMS devices. With the growth of MEMS technology, sensors and actuators that use piezoelectric device have been developed and commercialized in recent years. ULVAC believe that MEMS manufacturing technology, such as thin-film deposition and dry etching will be the key factor in producing high quality piezoelectric devices in the years to come.  

ULVAC GmbH was established in 1987 as the European subsidiary of ULVAC, Inc. located in Kirchheim (Munich), Germany. From Kirchheim, our sales and service teams serve the EMEA region to support manufacturers of MEMS, Power Devices, RF Devices as well as national laboratories. ULVAC offers a full line of sputtering, evaporation, plasma etching, ashing, ion implanting, PECVD for mass production and R&D.

 

Contact Information

ULVAC GmbH, R&D Center at Silex FAB2

contact: Thomas Simon

Tel. +49 89 960909-0

 

Website

http://www.ulvac.eu

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