Reactive Process Gas Monitoring System - Qulee RGM Series

This process monitoring system has been developed for various kinds of applications such as etch, CVD and other reactive gas processes. Using ULVAC’s original ion source and pumping system enables you to achieve stable measurements results.

Features

  • Most Appropriate for Etching/CVD Apparatus
    Long term stable measurements results
  • Closed Ion Source Utilizing a Magnetic Field
    Soft ionization provides less gas dissociation and higher sensitivity.
    Decomposition and adsorption due to thermal reactions are minimized
    in the ionization chamber.
  • Compact Conductance Valve with 3 Different Gas Inlet Modes
    Short distance between the process chamber and ion source allows
    quick-response of analysis.
  • Suitable for Process Monitoring
    Wide pressure range from 1×10-6 to 13kPa (7.5×10-9 to 97.5 Torr,
    1×10-8 to 130mbar) is available. (Choice of oriices)
  • Integrated Display
    No need for PC
  • Simple Operation
    "One Click" function
  • Bake Out
    Max 120˚C (248˚F) High temperature bake
  • Degas Function
    Electron bombard degas
  • Protection and Maintenance Feautures
    Protection and maintenance of ion source and secondary electron
    multiplier
    Traceability of analysis tube (patent pending)
  • Various Leak Tests are Available
    Helium leak test, air leak test, leak up
  • Total Pressure Measurement
    Capable of total pressure measurement (External ionization gauge (GI-M2)
  • Qulee QCS is Included
    This software is included and compatible with (Windows XP/7)

Special Features / Further Applications

  • For etching and CVD process
  • Monitoring reactive gases during process
  • End-point monitoring for etching and cleaning processes
  • Residual gas analyzing
  • Leak testing

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