In recent years, smart phones and tablets using SAW devices have risen considerably. Electromagnetic noise generated from interconnect of power supply, system on chip, memory, etc can interfere with RF devices and deteriorate its performance.
In the past, metal plates have been used as a popular method to eliminate interference, however, as chip size and devices become smaller and more sophisticated, technical trend is moving towards depositing EMI (Electromagnetic Interference) Shield by sputtering.This is becoming a more critical technology as the number of signal bands and devices increases in a single packages.

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