Dry Etching System for MEMS production NLD-5700
Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.
Our Products and Technologies
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ICP type etching chamber, CCP or Ashing chamber is also selectable as 2nd chamber.
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Low process pressure, high density plasma, low electron temperature are perfect for quartz glass, Pyrex, LN, LT etc.
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Good profile control and surface roughness.
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Good performance of deep SiO2 etching with PR.
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High etching rate of Quartz > 1μm/min, Pyrex > 0.8 μm/min.
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Excellent uniformity control.
Special Features / Further Applications
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Optical Devices (Wave guide, amplifier, optical switch etc), Micro lens, Photonics, μ-TAS etc.