Back Side Metallization Sputtering System SRH-530

SRH Serie (SRH-530) is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application

Our Products and Technologies


  • Applicable substrate size: φ125 to 200mm.

  • Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness.

  • Up to 5 unique process recipes.

  • Sputter-Etching process developed by ISM.


Special Features / Further Applications

  • Efficient water cooling mechanism by ESC method is available.



Further Applications

  • WL-CSP (seed layer of electrolytic plating)

  • UBM (Barrier metal)


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