Back Side Metallization Sputtering System SRH-530
SRH Serie (SRH-530) is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application
Our Products and Technologies
Applicable substrate size: φ125 to 200mm.
Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness.
Up to 5 unique process recipes.
Sputter-Etching process developed by ISM.
Special Features / Further Applications
- Efficient water cooling mechanism by ESC method is available.
WL-CSP (seed layer of electrolytic plating)
UBM (Barrier metal)