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A Batch System to Remove Native Oxide RISE-300
- Superior uniformity
- Easy maintenance
- Processing in batches of 50 wafers
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Dry Etching System for MEMS production NLD-5700
- Low process pressure
- High density plasma
- Low electron temperature
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Dry Etching System for Production NE-5700 & NE-7800
- High volume production
- Wide selection of tool configuration
- Stable etching rate
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Dry Etching Tool APIOS NE-950EX
- 2 to 6inch wafers
- Higher Through-Put
- High maintainability, stability and reliability
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High-Density Plasma Etching System NE-550
- Specifically for R&D
- Precise wafer temperature control
- Precise and stable EPD