Products

A Batch System to Remove Native Oxide RISE-300

1. Superior uniformity
2. Easy maintenance
3. Processing in batches of 50 wafers

Dry Etching System for MEMS production NLD-5700

1. Low process pressure
2. High density plasma
3. Low electron temperature

Dry Etching System for Production NE-5700 & NE-7800

1. High volume production
2. Wide selection of tool configuration
3. Stable etching rate

Dry Etching Tool APIOS NE-950EX

1. 2 to 6inch wafers
2. Higher Through-Put
3. High maintainability, stability and reliability

High-Density Plasma Etching System NE-550

1. Specifically for R&D
2. Precise wafer temperature control
3. Precise and stable EPD