A Batch System to Remove Native Oxide RISE-300
Batch type equipment of chemical dry cleaning for remoral of native oxide in Narrow and Deep-contact patterns of advanced semiconductor.
Features
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Damage-free (remote plasma and low-temperature process)
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High throughput and low CoO
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Processing in batches of fifty wafers
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Superior uniformity of etching (5% or less per batch)
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Easy maintenance (no side maintenance access is required)
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Small foot print compare to cluster type equipment
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50% lower self-aligned contact resistance compared to current wet process
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The Smallest foot print
Special Features / Further Applications
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Pre-cleaning for self-aligned contact (SAC) formation
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Pre-cleaning for capacitor formation
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Pre-cleaning for epitaxial growth
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Pre-cleaning for Co or Ni salicide