A Batch System to Remove Native Oxide RISE-300

Batch type equipment of chemical dry cleaning for remoral of native oxide in Narrow and Deep-contact patterns of advanced semiconductor.

Features

  • Damage-free (remote plasma and low-temperature process)

  • High throughput and low CoO

  • Processing in batches of fifty wafers

  • Superior uniformity of etching (5% or less per batch)

  • Easy maintenance (no side maintenance access is required)

  • Small foot print compare to cluster type equipment

  • 50% lower self-aligned contact resistance compared to current wet process

  • The Smallest foot print

 

Special Features / Further Applications

  • Pre-cleaning for self-aligned contact (SAC) formation

  • Pre-cleaning for capacitor formation

  • Pre-cleaning for epitaxial growth

  • Pre-cleaning for Co or Ni salicide

 

Any questions?
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