ULVAC’s sputtering systems have the best track record in the industry.
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Magnetic Multi-Layer System Magest S200
- Triple-gun cathode
- Outstanding controllability
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Load-lock-type Sputtering System SDH-4550L
- Compact footprint
- Capability to deposit cosmetic films over EMI shield
- Low temperature process
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Load-lock-type Sputtering System CS-200
- Footprint 0.9 x 2.3m
- designed for small production
- annealing at 2000°C for sputtered carbon
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Back Side Metallization Sputtering System SRH-530
- ESC method available
- sizes 125 to 200mm
- up to 5 process recipes
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Cluster-type Sputtering System SME-200
- Easy maintenance
- Outstanding film stress control and particle reduction
- High-quality deposition