Load-lock-type Sputtering System CS-200

Load-lock type Sputtering System CS 200 is for research & development and small production application.

Features

 

  • vacuum load lock sputtering system with tray handling ø320mm
  • four cathodes each ø100mm with shutter
  • co-sputtering, DC, puls-DC, RF
  • adjustable distance T/S from 60 to 180mm
  • roughness of ≤0.5nm after annealing @2000°C for sputtered carbon cap @RT
  • footprint 0.9m x 2.3m

Special Features / Further Applications

Especially designed for small production and R&D purpose

Any questions?
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