Load-lock-type Sputtering System CS-200
Load-lock type Sputtering System CS 200 is for research & development and small production application.
Features
- vacuum load lock sputtering system with tray handling ø320mm
- four cathodes each ø100mm with shutter
- co-sputtering, DC, puls-DC, RF
- adjustable distance T/S from 60 to 180mm
- roughness of ≤0.5nm after annealing @2000°C for sputtered carbon cap @RT
- footprint 0.9m x 2.3m
Special Features / Further Applications
Especially designed for small production and R&D purpose