Load-lock-type Sputtering System SDH-4550L

In recent years, smart phones and tablets using SAW devices have risen considerably. Electromagnetic noise generated from interconnect of power supply, system on chip, memory, etc can interfere with RF devices and deteriorate its performance. In the past, metal plates have been used as a popular method to eliminate interference, however, as chip size and devices become smaller and more sophisticated, technical trend is moving towards depositing EMI (Electromagnetic Interference) Shield by sputtering. This equipment is used to deposit EMI shield (Electromagnetic Interference Shield) for various frequency band in production with low temperature process.