Back Side Metallization Sputtering System SRH-530
SRH Serie (SRH-530) is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application
Features
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Applicable substrate size: φ125 to 200mm.
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Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness.
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Up to 5 unique process recipes.
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Sputter-Etching process developed by ISM.
Special Features / Further Applications
- Efficient water cooling mechanism by ESC method is available.
Further Applications
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WL-CSP (seed layer of electrolytic plating)
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UBM (Barrier metal)