Load-Lock-type High Vacuum Evaporation System CV-Series

CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.

Features

 

  • Load-lock type system to support high vacuum processes.

  • Supports various substrate sizes.

  • Supports substrate holder transfer.

  • Supports lift-off deposition (standard; φ4 inch, option; up to φ6).

  • Supports various evaporation sources (i.e. EB,RH, etc.).

  • Supports high temperature heating (maximum of 450ºC).

  • Vacuum box-enabled indirect sequential processing within C-series (Sputter: CS-200, P-CVD: CC-200, Polymerizing evaporation: CP-200).

 

Special Features / Further Applications

 

  • Power devices.

  • Compound-related devices of LED, LD and high speed devices.

  • Organic EL material system for R&D use.

  • Oxide evaporation of liquid crystal alignment layers.

 

Any questions?
Contact us