Sputtering Targets for Flat Panel Display Applications


  • We support sputtering targets for all fields including TFT, OLED (LTPS: Low-temperature polysilicon) and touch panels.
  • Ultrasonic defect testers ensure meticulous quality assurance! ULVAC has installed large ultrasonic test equipment to make meticulous defect inspections of materials and bonding inspections. Using this equipment has helped ULVAC drastically cut down on arcing during sputtering and deliver high quality targets.
  • High-reliability metal bonding technology
    Large sputtering targets are very heavy so technology for bonding to a cooling plate (backing plate) is extremely important. ULVAC has installed bonding equipment to support deposition of larger glass substrate, and realized an all-inclusive target supply system.
  • Low-particle targets
  • Attaining high uniformity by adjusting the metal microstructure

  Cu-Mg-Al Alloy for Low-Resistance Copper Wiring

  • Ideal target for deposition forming in low-resistance wiring processes. (Stacking structure uses Cu-Mg-Al alloy as adhesion layer for pure copper film)
  • Good adhesion to glass substrates, oxide layers (ITO, etc.), and silicon system under layers (SiO2).
  • Wet etch processing is easy because the copper material is similar to the wiring layer material. (Processing can also use etching solution (single fluid) not containing hydrogen peroxide or fluoric acid.)
  • Low-cost process
  • Inexpensive target material

Sputtering Targets for FPD

Application Field  Materials  Purpose of Use 
Low temperature poly-Si TFT materials Al(5N) & Al alloy  Wiring materials
Mobile terminals/monitors  Ti(4N5)  Electrode/barrier materials
Mo(3N)  Electrode/barrier materials 
ITO(4N)  Transparent conductive films
High temperature poly-Si TFT materials  AlSi(5N) & AlCu(5N) Wiring materials 
Rear projection televisions Ti(4N5) Electrode/barrier materials
High-definition monitors  WSi  Electrode materials
ITO(4N)  Transparent conductive films
PDP  Al(5N) & Al alloy  Wiring materials 
PDP-TV  Cr(3N)  Barrier/ adhesion film materials
Cu(4N)  Wiring materials
ITO(4N)  Transparent conductive films
OLED (organic EL) materials  ITO(4N)  Transparent conductive films
Mobile terminals  Ag & Ag alloy  Reflective/ electrode  
Mg  Electrode 
Al & Al alloy  Wiring/electrode
FED/SED materials  Al(5N) & Al alloy Wiring materials 
Monitors/TVs  Cr(3N) Barrier/ adhesion film materials
Various precious metals(4N) Wiring materials
ITO(4N) Transparent conductive films 
Nb(3N) Electrode materials
STN, color filter materials  Si & SiO2(4N)  Insulating/under-layer material 
Mobile phones/terminals  Cr(3N)  BM materials
Ag alloy(4N)  STN reflective electrode materials
ITO(4N)  Transparent conductive films 
Amorphous Si-TFT materials  Al(5N) & AlCe alloy  Wiring materials
Cu(4N) & Cu alloy  Wiring materials
Mo(3N)  Electrode/barrier materials
Cr(3N)  Electrode/barrier materials
Ti(3N)  Electrode/barrier materials
ITO(4N)  Transparent conductive films 

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